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Comunicación / Módulos
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Karo QS93

The QS8M is a QFN Style Solder-Down Computer On Module. The module with a small square size of 27mm and a height of 2.3mm is single-sided assembled. Its QFN type lead style has a 1mm pitch with 100 pads. The ground pad additionally acts as thermal pad.
  • NXP i.MX 93
    • Dual ARM® Cortex®-A55, 1.5 GHz
    • ARM® Cortex®-M33, 250 MHz
    • ARM® Ethos® U-65 microNPU
    • NXP’s EdgeLock® secure enclave
  • RAM
    • 1 GB LPDDR4
  • ROM
    • 4 GB eMMC
  • Grade
    • Industrial
  • Temperature
    • -40°C to 85°C
  • Display support
    • LVDS Display Interface
    • 2D GPU: blending/composition, resize, color space conversion
Comunicación / Módulos
Digital Signage
Energía
Gaming
Industria
Kiosk
Medicina
Seguridad
Smart City
Transporte
  • ARM
    ARM
  • Interfaz
    Interfaz
  • Linux
    Linux
  • USB
    USB

Specifications

Part Number QS93-5210
Part Name QS93/52C/1GS/4GF/I
Processor NXP i.MX9352
SDRAM 1 GiB
Flash 4 GB
Display-IF LVDS
Temperature -40 °C to 85 °C



Connectivity

2x USB 2.0
2x Gb Ethernet, RGMII
1x eMMC/SD
2x FlexCAN
5x UART, 7x I²C, 4x SPI, 6x PWM, SAI
Up to 60x 3.3V General Purpose I/O
MIPI-CSI (2-lane)

OS Support
Linux