Karo QSXM-MM60

The QSXM is a QFN Style Solder-Down Computer On Module. The module with a small square size of 29mm and a height of 2.6 mm is single-sided assembled. Its QFN type lead style has a 1mm pitch with 108 pads. The ground pad additionally acts as thermal pad.

NXP i.MX 8M Mini Quad Cortex-A53 up to 1.6 GHz Cortex-M4 up to 400 MHz
RAM 2 GB LPDDR4
ROM 4 GB eMMC
Grade Industrial
Temperature -25°C to 85°C
- Display support
- MIPI DSI (4-lane)
- GC328 2D GPU
- GCNanoUltra 3D GPU
- 1080p60 video de-/encode

Digital Signage / Módulos
Industria
Medicina
Transporte

ARM
Interfaz
Linux
Serie
USB
Rango extendido de temperatura
Windows

Specifications

QSXM Facts
Processor	NXP i.MX 8M Mini
Cores	Quad Cortex^®-A53, 1.6 GHz
RAM	2 GB LPDDR4
Flash	4 GB eMMC
Extra features compared to QS8M	PCIe, LPDDR4, 3.3-5V power supply
Temperature	-25 °C to 85 °C
Dimensions (LxWxD)	29 mm x 29 mm x 2.6 mm
Datasheets	QSXM

• NXP i.MX 8M Mini Quad Cortex-A53 up to 1.6 GHz
Cortex-M4 up to 400 MHz
• RAM 2 GB LPDDR4 • ROM 4 GB eMMC • Grade Industrial
• Temperature -25°C to 85°C
• Display support

◦ MIPI DSI (4-lane)

◦ GC328 2D GPU

◦ GCNanoUltra 3D GPU

◦ 1080p60 video de-/encode

• Connectivity

◦ 2x USB 2.0

◦ 1x Gb Ethernet, RGMII

◦ 1x eMMC/SD

◦ 1x PCIe® Gen 3, 1-lane

◦ 4x UART, 3x I²C, 2x SPI, 4x PWM, SAI

◦ Up to 60x 3.3V General Purpose I/O

OS Support

• Linux

• Windows 10 IoT

Download qsxm.pdf