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Industria / Placas
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Seco SBC-3.5-MX8M-Mini

3.5" SBC with NXP i.MX 8M miniprocessors. (ASTRID - C61)
  • NXP i.MX 8M Mini Family
  • GC320 2D accelerator + GCNanoUltra 3D accelerator
  • Up to 2x GbE; opt Wi-Fi; up to 2x RS-232 or RS-485 or CAN; opt LTE Cat4 Modem with SIM slot or eSIM
  • Soldered on-board LPDDR4-3000 memory
Industria / Placas
Smart City
  • Bluetooth
    Bluetooth
  • DC
    DC
  • Interfaz
    Interfaz
  • Serie
    Serie
  • USB
    USB
  • Wifi
    Wifi

Specifications

Description 3.5" SBC with NXP i.MX 8M miniprocessors
Cpu NXP i.MX 8M Mini Family based on ARM® Cortex®-A53 cores + general purpose Cortex®-M4 400MHz processor:
i.MX 8M Mini Quad – Full featured, 4x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Dual – Full featured, 2x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Solo – Full featured, 1x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Quad Lite – 4x Cortex®-A53 cores up to 1.8GHz, no VPU
i.MX 8M Mini Dual Lite – 2x Cortex®-A53 cores up to 1.8GHz, no VPU
i.MX 8M Mini Solo Lite – 1x Cortex®-A53 cores up to 1.8GHz, no VPU
Max cores 4+1
Memory Soldered-down LPDDR4 memory, up to 4GB total, 32-bit interface
Graph GC320 2D accelerator + GCNanoUltra 3D accelerator Embedded VPU (not for Lite processors), able to offer:
VP9, ​​HEVC/H.265, AVC/H.264, VP8 HW Decoding
AVC/H.264, VP8 HW encoding
OpenGL ES 2.0, OpenVG 1.1 support
Video interfaces LVDS Single/Dual Channel connector or eDP connector (factory alternatives)
MIPI-CSI Camera interface connector
Video resolution Up to 1920x1080p60, 24bpp
Mass storage Optional eMMC 5.1 drive on-board, up to 64GB
MicroSD slot
2Kb I2C Flash
QSPI Flash
Networking 2x GbEthernet interfaces (1 optional)
Optional shielded ultra-small dual Band WiFi 802.11 a/b/g/n/ac with BT 5.0 module onboard
Optional soldered on-board LTE Cat 4 Modem with SIM slot or Telenor eSIM with 5MB Bundle



Usb 2x USB 2.0 Host ports on Type-A socket
2x USB 2.0 Host ports on internal pin header
1x USB Host or client port on micro-AB connector (interface shared with the optional on-board modem)
Audio Digital Mic In connector (2x PDM inputs)
Amplified mono Speaker Output
Serial ports Up to 2x RS-232 or RS-485 or CAN Serial ports (factory options, shared with GPIOs and SPI interfaces)
2x Debug UARTS
Other interfaces I/O Connectors with:
  • 2xPWM @3.3V
  • GP I2C interface @3.3V
  • 1x Open Drain output (max 12V, 250mA)
  • 2x GPIOs @3.3V
  • 1xRS-232 or 1x RS-485 or 4x GPIOs / 1x UART or 1x CAN (factory options)
  • 1xRS-232 or 1x RS-485 or 4x GPIOs / 1x UART or 1x CAN + on-board ultra-low power RTC (factory options)
Watchdog
Dedicated connector for I2C Touch Screen Controller Support
Onboard Buzzer ( Comm. temp. range only)
Optional Ultra Low Power RTC
Electrical power supply +12VDC÷ +24VDC
OP Yocto
Android (planned
Operating temperature 0°C ÷ +60°C (extended version)
-40°C ÷ +85°C (industrial version, limited to -30°C ÷ +85°C with WiFi/BT module on-board)
*Measured at any point of SECO standard heatsink for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the indicated range.
Dimensions 146x102 mm (3.5" form factor)