Seco SOM-COM-HPC-A-TGL-H

Módulo cliente COM-HPC® de tamaño A con procesadores Intel® Xeon® de 11.ª generación de la serie W-11000E, Core™ vPro® y Celeron® (Codename: Tiger Lake-H) para aplicaciones FuSa. (LAGOON - D57)

11th Gen Intel® Xeon®, Core™ and Celeron® processors
Intel® Iris Xe Graphics Core Gen12 GPU with up to 32 EU, up to 4 independent displays
2x USB 4; 2x USB 3.2 Gen 2x2; 8x USB 2.0; 20x PCI-e Gen3 lanes; 20x PCI-e Gen4 lanes; up to 2x 2.5GbE
Two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory

Digital Signage / Módulos
Industria
Kiosk
Medicina
Smart City
Transporte

Android
DC
Display Port
HDMI
Intel
Interfaz
Linux
Serie
USB
Windows

Specifications

Description	Módulo cliente COM-HPC® de tamaño A con procesadores Intel® Xeon® de 11.ª generación de la serie W-11000E, Core™ vPro® y Celeron® (antes Tiger Lake-H) para aplicaciones FuSa
Cpu	11th Generation Intel® Xeon®, Core™ and Celeron® Processors, also available in industrial temperature range. Intel® Core™ vPRO® i7-11850HE, Eight Core @ 2.6GHz (up to 4.7GHz in Turbo Boost) with HT, 24MB Cache L3, 45/35W cTDP Intel® Core™ vPRO® i5-11500HE, Six Core @ 2.6GHz (up to 4.5GHz in Turbo Boost) with HT, 12MB L3 Cache, 45/35W cTDP Intel® Core™ i3-11100HE, Quad Core @ 2.4GHz (up to 4.4GHz in Turbo Boost) with HT, 8MB L3 Cache, 45/35W cTDP Intel® Celeron® 6600HE, Dual Core @2.6GHz, 8MB L3 Cache, 35W TDP Intel® Xeon® vPRO® W-11865MRE, Eight Core @ 2.6GHz (up to 4.7GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC, TCC/TSN and Functional Safety Essential Design package, 45/35W cTDP – Industrial (w/ Turbo OFF) Intel® Xeon® vPRO® W-11555MRE, Six Core @ 2.6GHz (up to 4.5GHz in Turbo Boost) with HT, 12MB L3 Cache, with ECC, TCC/TSN and Functional Safety Essential Design package, 45/35W cTDP – Industrial (w/ Turbo OFF) Intel® Xeon® W-11155MRE, Quad Core @ 2.4GHz (up to 4.4GHz in Turbo Boost) with HT, 8MB L3 Cache, with ECC and TCC/TSN, 45/35W cTDP – Industrial (w/ Turbo OFF) Intel® Xeon® vPRO® W-11865MLE, Eight Core @ 1.5GHz (up to 4.5GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP Intel® Xeon® vPRO® W-11555MLE, Six Core @ 1.9GHz (up to 4.4GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP Intel® Xeon® W-11155MLE, Quad Core @ 1.8GHz (up to 3.1GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP B Cache, 28/15/12W cTDP - Industrial (w/ Turbo OFF)
Max cores	8
Memory	2x DDR4-3200 SODIMM Slots with ECC (In-Band Error Correction Code), up to 64GB supported
Graph	Integrated Iris AVC/H.264, HEVC/H.265, JPEG, VP9 HW encoding, up to 8k30 Support up to 4 independent displays.
Video interfaces	1x eDP 1.4b or MIPI_DSI 1.3 Up to 3x DP++ interface, supporting Display Port 1.4a and HDMI 2.0b Up to 2x Display Port over Type-C (Alternate mode)

Video resolution	DP, eDP: Up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC MIPI-DSI: Up to 3200x2000 @60Hz 24bpp, 5120x3200 @60Hz 24bpp with DSC HDMI 1.4: Up to 4Kx2K 24-30Hz 24bpp HDMI 2.0b: Up to 4Kx2K 48-60Hz 24bpp / 4Kx2K 48- 60Hz 12bpc (need dedicated redriver on carrier board)
Mass storage	2 x S-ATA Gen3 Channels PCI-e x4 port can be used to connect, on the carrier board, M.2 NVMe drives
Networking	Up to 2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet connection, managed by as many Intel® i225 2.5GbE Controllers with TSN
Usb	2x USB4 ports 2x USB 3.2 Gen 2x2 ports 8 x USB 2.0 Host ports
Pci	1x PCI-e x4 Gen 4 port for NVME 16x PCI-e Gen4 lanes, can be used to support 1x PCI-e x16, 2x PCI-e x8 or (1x PCI-e x8 +2x PCI-e x4) root ports 20x PCI-e Gen 3 lanes, groupable to support up to 12 root ports, max allowed grouping PCI-e x4
Audio	SoundWire and I2S Audio Interface
Serial ports	2x legacy UARTs, managed by the Embedded Controller
Other interfaces	2x 4-lane CSI-2 interfaces, optional SPI, eSPI, SM Bus, 2x I2C, Watchdog timer, Carrier board FAN Control Management signals, ACPI signals, Safety Status signals Deep Sleep / Battery support Optional TPM 2.0 module on-board 12x GPIOs
Electrical power supply	+12VDC ± 10% and +5VSB (optional)
Operating system	Microsoft® Windows 7 (only for Skylake) Microsoft® Windows 10 Linux
Operating temperature	0°C ÷ +60°C (commercial version) -40°C / +70°C (Extended Temperature Range) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	125 x 95 mm (COM Express Basic, 4.92” x 3,74”)