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Energía / Módulos
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Seco SOM-COMe-BT7-E3000

Módulo COM Express® Rel.3.0 Basic Tipo 7 con la serie de SoCs AMD EPYC™ incorporado 3000, (THEBE - C42).
  • AMD EPYC™ Embedded 3000 family of SoCs
  • Gráficas N.A
  • 4x USB 3.1; 24x PCI-e Gen3 lanes
  • Four DDR4 SO-DIMM Slots supporting DDR4-2666 Memory with ECC, up to 128GB
Energía / Módulos
Industria
  • AMD
    AMD
  • Interfaz
    Interfaz
  • Linux
    Linux
  • Serie
    Serie
  • USB
    USB
  • Windows
    Windows

Specifications

Description This innovative Computer on Module (CoM) provides scalable offerings with outstanding performance and more connectivity. Networking and connectivity are improved with the 4x 10GBASE-KR interfaces + 1x 1GbE port with NC-SI and the 4 USB 3.1; 24x PCI-e Gen3 lanes. Moreover, the performance is enhanced by the four DDR4 SO-DIMM slots supporting DDR4-2666 memory with ECC, up to 128GB. The AMD EPYC™ Embedded 3000 shows major improvements in power, optimization, and security. The main features of this new processor are I/O integration, flexibility, and security capabilities, scalable offering, harnessing the power of the new “Zen” CPU architecture. Performance-per-dollar is greatly improved, making it a great choice for development.
Cpu

AMD EPYC™ Embedded 3000 family of SoCs:

  • AMD EPYC™ Embedded 3451, Sixteen Core Dual Thread @ 2.14GHz (3.0 Boost), 32MB L3 shared Cache, TDP 80-100W
  • AMD EPYC™ Embedded 3351, Twelve Core Dual Thread @ 1.9GHz (3.0 Boost), 32MB L3 shared Cache, TDP 60-80W
  • AMD EPYC™ Embedded 3251, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 shared Cache, TDP 55W
  • AMD EPYC™ Embedded 3201, Eight Core Single Thread @ 1.5GHz (3.1 Boost), 16MB L3 shared Cache, TDP 30W
  • AMD EPYC™ Embedded 3151, Quad Core Dual Thread @ 2.7GHz (2.9 Boost), 16MB L3 shared Cache, TDP 45W
  • AMD EPYC™ Embedded 3101, Quad Core Single Thread @ 2.1GHz (2.9 Boost), 8MB L3 shared Cache, TDP 35W
  • AMD EPYC™ Embedded 3255, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 Shared Cache, TDP 55W, industrial grade 
Memory Up to 4x DDR4 SO-DIMM Slots supporting DDR4-2666 Memory (both ECC and not-ECC supported), up to 128GB



Mass storage 2x S-ATA Gen3 Channels
Networking 1x Gigabit Ethernet LAN port with NC-SI (Network Controller Sideband Interface) functionality, managed by an Intel® I210 Gigabit Ethernet Controller
4x 10Gigabit Ethernet interfaces (10GBASE-KR), directly managed by the EPYC™ SoCs
Usb 4 x USB 3.1 Host ports (SS + USB 2.0 interfaces)
PCI 24x PCI-e Gen3 lanes
Serial ports 2x legacy UARTs, 16C550 compatible
Other interfaces SPI, SM Bus, LPC bus
Security Optional TPM 2.0 module on-board
AMD Secure Processor for Crypto Co-processing
Hardware Validated Boot capabilities
Secure Memory Encryption
Secure Encrypted Virtualization
Electrical power supply +12VDC ± 10% and + 5VSB (optional)
OS Microsoft® Windows 10
Microsoft® Windows Server 2016
Linux OS 64-bit
Operating temperature 0°C ÷ +60 °C (Commercial version)
-40°÷+85°C (Industrial Range, when available)
*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the indicated range.
Dimensions 125 x 95 mm (Com Express™ Basic Form factor, Type 7 pinout)