Seco SOM-COMe-CT6-MBPF

Computer on Module (CoM) COM Express® Compact Tipo 6 con SoC AMD incorporado de 3.ª generación Serie R (Codename: Merlin Falcon), SoC Serie G-I (Codename: Brown Falcon) o SoC Serie G-J (Codename: Prairie Falcon) . (AMOS - A98)

AMD Embedded 3rd generation R-Series SOC, G-Series SOC-I or G-Series SoC-J
AMD Radeon 3rd -Generation Graphics Core Next (GCN)
4x USB 3.0; 8x USB 2.0; 3x PCI-e x1 Gen3
Two SO-DIMM slots supporting DDR4 ECC and non-ECC modules

Digital Signage / Módulos
Industria
Kiosk
Medicina

AMD
DC
Display Port
Intel
Interfaz
Linux
USB
VGA
Windows

Specifications

Description	SOM-COMe-CT6-MBPF is a COM Express® Compact Type 6 Computer on Module (CoM) with the AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon) designed by SECO that features up to 4 Excavator x86 CPU cores with the latest Radeon graphics and I / O Controller on a single Chip; each Processor can scale the TDP down to 15W. SOM-COMe-CT6-MBPF is ideal in applications where scalable graphics performance makes the difference.
Cpu	AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W AMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W AMD GX-215IJ, Dual Core @1.5GHz (2.0GHz Max), cTDP 6-10W
Max cores	4
Memory	R-Series: Two SO-DIMM slots supporting DDR4 ECC / nonECC modules up to 2133MHz G-Series SoC-I: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 1600MHz G-Series SoC-J: One SO-DIMM slot supporting DDR4 nonECC modules up to 2133MHz
Print shop	AMD Radeon 3rd -Generation Graphics Core Next (GCN) AMD RX-421BD - Radeon R7 AMD RX-418GD, RX-416GD - Radeon R6 AMD-RX-216GD - Radeon R5 AMD GX-217GI - Radeon R6E AMD GX-224IJ - Radeon R4E AMD GX-215IJ - Radeon R2E Up to 3 independent displays supported (up to 2 with G-Series SoC-I and SoC-J) DirectX® 12 supported UVD 6 (4K H.265 and H.264 decode) and VCE 3.1 (4KH.264 encode) supported

Video interfaces	Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0 (up to 2x DDIs with G-Series SoC-I and SoC-J) Optional VGA interface (excludes one DDI Port) Optional eDP or Single / Dual-Channel 18- / 24- bit LVDS interface (excludes one DDI Port)
Video resolution	DDIs: up to 4K LVDS, VGA: up to 1920 x 1200 @ 60Hz
Mass storage	2 x SATA Gen3 Channels SD interface shared with GPI/Os
Networking	Gigabit Ethernet interface Intel® I210 / I211 GbE Controller
Usb	4 x USB 3.0 Host ports 8 x USB 2.0 Host ports
Pci	3 x PCI-e x 1 lanes PCI-express Graphics (PEG) x8 (R-Series SoCs) or x4 (G-Series SOC-I and SoC-J)
Audio	HD Audio Interface
Serial ports	2 x HS UARTs
Other interfaces	SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management LID# / SLEEP# / PWRBTN#, Watchdog 4 x GPI, 4 x GPO (multiplexed with SD interface) Optional TPM 1.2 or 2.0 module onboard
Electrical power supply	+12VDC ± 10% and + 5VSB (optional)
Operating system	Microsoft® Windows 7 Microsoft® Windows 10 Microsoft® Windows 10 IoT Linux
Operating temperature	0°C ÷ +60 °C (Commercial version) -40°C ÷ +85°C (Industrial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)