SiliconPower M.2 2260 MDB550S 3D TLC
Characteristics
- NGFF M.2 (B+M Key) standard form factor
- Compliant with Serial ATA Revision 3.1 standard with 6.0 Gb/s transfer rate
- Support SP Toolbox SMART health monitoring software
- Supports Data Security AES Encryption (optional)
Comunicación / MemoriasDigital Signage
Energía
Gaming
Industria
Kiosk
Smart City
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TLC
Specifications
- Flash Technology
- pSLC (3D TLC)
- Capacity
- 32GB ~ 256GB
- Interface
- SATA III/6.0Gbps
- Storage Temperature
- -55°C ～ 95°C
- Seq. Performance Read (max.)
- 560 MB/s
- Seq. Performance Write (max.)
- 520 MB/s
- Random 4K Read (IOPS max.)
- 78000
- Random 4K Write (IOPS max.)
- 86000
- Power Requirement
- DC 3.3V
- Power Consumption(max.)
- 580 mA
- Power Consumption (idle)
- 110 mA
- Operating Temp. (Standard)
- SP***GIMDB55*SV0
- Operating Temp. (Wide)
- SP***GIMDB55*SW0
- Operating Humidity
- 10% ～ 95% (30°C Max. Wet Bulb Temp)
- Vibration
- 15G, 10~2000Hz
- Drop
- 75cm
- Shock
- 1,500G@0.5ms
- Power Shield
- TRIM
- S.M.A.R.T.
- DEVSLP
- AES 256
- SP SMART Utility
- External DRAM Buffer
- Warranty
- 5 years and within guranteed TBW