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Comunicación / Memorias
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SiliconPower M.2 2280 MDC550S 3D TLC

Characteristics

  • NGFF M.2 (B+M Key) standard form factor
  • Compliant with Serial ATA Revision 3.1 standard with 6.0 Gb/s transfer rate
  • Equipped with advanced PFP technology (optional)
  • Supports Data Security AES Encryption (optional)
  • Support SP Toolbox SMART health monitoring software
Comunicación / Memorias
Digital Signage
Energía
Gaming
Industria
Kiosk
Smart City
  • DC
    DC
  • DRAM
    DRAM
  • Interfaz
    Interfaz
  • Serie
    Serie
  • TLC
    TLC

Specifications

  • Capacity
    • 32GB ~ 256GB
  • Interface
    • SATA III/6.0Gbps
  • Storage Temperature
    • -55°C ～ 95°C
  • Seq. Performance Read (max.)
    • 560 MB/s
  • Seq. Performance Write (max.)
    • 520 MB/s
  • Random 4K Read (IOPS max.)
    • 94000
  • Random 4K Write (IOPS max.)
    • 89000
  • Power Requirement
    • DC 3.3V
  • Power Consumption(max.)
    • 750 mA
  • Power Consumption (idle)
    • 110 mA
  • Dimension（mm）
    • 80.0 x 22.0 x 3.5 mm



  • MTBF (est)
    • ≒2,000,000 hrs
  • Operating Temp. (Standard)
    • SP***GIMDC55*SV0
  • Operating Temp. (Wide)
    • SP***GIMDC55*SW0
  • Vibration
    • 15G, 10 ～ 2000Hz
  • Drop
    • 75cm
  • Shock
    • 1,500G@0.5ms
  • Power Shield
  • TRIM
  • S.M.A.R.T.
  • DEVSLP
  • AES 256
  • SP SMART Utility
  • External DRAM Buffer
  • Warranty
    • 5 years and within guranteed TBW