SiliconPower M.2 2280 MEC350S 3D TLC
3D TLCCharacteristics
- NGFF M.2 (B+M Key) standard form factor
- Compliant with Serial ATA Revision 3.1 standard with 6.0 Gb/s transfer rate
- Equipped with advanced PFP technology (optional)
- Supports Data Security AES Encryption (optional)
- Support SP Toolbox SMART health monitoring software
Comunicación / MemoriasDigital Signage
Energía
Gaming
Industria
Kiosk
Smart City
-
DC
-
DRAM
-
Interfaz
-
TLC
-
Rango extendido de temperatura
Specifications
- Capacity
- 128GB ~ 2TB
- Interface
- PCIe Gen3x4, NVMe
- Storage Temperature
- -55°C ～ 95°C
- Seq. Performance Read (max.)
- 3,400 MB/s
- Seq. Performance Write (max.)
- 2,900 MB/s
- Random 4K Read (IOPS max.)
- 345000
- Random 4K Write (IOPS max.)
- 350000
- Power Requirement
- DC 3.3V
- Power Consumption(max.)
- 2450 mA
- Power Consumption (idle)
- 230 mA
- Dimension（mm）
- 80.0 x 22.0 x 3.6
- MTBF (est)
- ≒2,000,000 hrs
- Operating Temp. (Standard)
- SP***GIMEC35*SV0
- Operating Temp. (Wide)
- SP***GIMEC351SW0
- Operating Humidity
- 10% ～ 95% (30°C Max. Wet Bulb Temp)
- Vibration
- 15G, 10~2000Hz
- Drop
- 75cm
- Shock
- 1,500G@0.5ms
- Power Shield
- End-to-End Data Protection
- TRIM
- S.M.A.R.T.
- DEVSLP
- AES 256
- SP SMART Utility
- External DRAM Buffer
- Warranty
- 3 years and within TBW