SiliconPower M.2 2280 MEC3H0S 3D TLC
3D TLC- NGFF M.2 (M Key) standard form factor
- Compliant with NVMe Express 1.4
- Support Data Security with AES 256 Encryption (Optional)
- Support SP Toolbox SMART health monitoring software
Comunicación / MemoriasDigital Signage
Energía
Gaming
Industria
Kiosk
Smart City
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DC
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DRAM
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Interfaz
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TLC
Specifications
| Flash Technology | 3D TLC |
| Ability | 480GB, 960GB, 1.9TB, 3.8TB |
| Interface | PCIe Gen4x4, NVMe |
| Storage temperature | -55℃ ～ 95℃ |
| Seq. Performance Read (max.) | 7,200 MB/s (estimated) |
| Seq. Performance Write (max.) | 6,800 MB/s (estimated) |
| Random 4K Read (IOPS max.) | 1,000,000 (estimated) |
| Random 4K Write (IOPS max.) | 1,000,000 (estimated) |
| Power Requirement | DC 3.3V |
| Dimension（mm) | 80.0 x 22.0 x 3.6 |
| MTBF (east) | > 3,000,000 hrs *at 25 degrees Celsius , based on specification MIL-HDBK-217F part count method & Telcordia SR-332 Method |
| Operating Temp. (Standard) | -20°C ～ 75°C |
| Operating Temp. (Wide) | -40°C ～ 85°C |
| Vibration | 15G, 10~2000Hz |
| Release | 75cm |
| Shock | 1,500G@0.5ms |
| Power Shield | ● |
| End-to-End Data Protection | ● |
| TRIM | ● |
| S.M.A.R.T. | ● |
| DEVSLP | ● |
| SP SMART Utility | ● |
| External DRAM Buffer | ● |
| Warranty | 3 years and within TBW |