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Vecow EAC-5100

Vecow EAC-5000 Series is powered by NVIDIA Jetson AGX Orin platform that features an Arm® Cortex®-A78AE CPU delivering up to 275 TOPS of AI performance and integrates an advanced NVIDIA Ampere architecture GPU with 64 Tensor Cores. It’s capable of delivering server-class performance for edge AI applications. The EAC-5000 Series is rugged in design and supports high compute density with I/O flexibility, including 8 GMSL2 cameras, 1 PCIe x8 slot, 2 GigE LAN with an optional choice of X-coded M12 connector, 5 USB, 2 COM, 2 Isolated CAN Bus, and 2 SIM card sockets. With support for 9V to 50V wide range DC-in, operating temperature range from -25°C to 70°C, as well as software ignition control, Vecow EAC-5000 Series is ideal for in-vehicle computing, robotic control, machine vision, intelligent video analytics, mobile robots, and any embedded AI applications.
  • Adavnced NVIDIA® Jetson AGX Orin™ platform delivers up to 275 TOPS AI performance
  • Latest NVIDIA Ampere™ architecture, featuring with 2048 NVIDIA® CUDA® cores and 64 Tensor cores
  • 1 PCIe Gen4 x8 expansion slot supports optional multiple 10GigE/PoE LAN/USB connections
  • 2 Isolated CAN Bus support Flexible Data-rate,2 COM RS-232/422/485
  • 6 GigE LAN with 4 PoE+, 5 USB 3.1, 1 Digital Display supports 8K60
  • Supports device remote management by Allxon
  • DC 9V to 50V wide range power input, Ignition Power Control
Industria / Sistemas
Seguridad
Transporte
  • 4G
    4G
  • 5G
    5G
  • ARM
    ARM
  • DC
    DC
  • Interfaz
    Interfaz
  • LAN
    LAN
  • Lte
    Lte
  • POE
    POE
  • Serie
    Serie
  • SSD
    SSD
  • USB
    USB
  • Wifi
    Wifi

Specifications

System
CPU
EAC-5100-R32 : 8-core Arm® Cortex®-A78AE v8.2 64-bit CPU
EAC-5100-R64 : 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU
GPU
EAC-5100-R32 : 1792-core NVIDIA Ampere™ architecture GPU with 56 Tensor Cores
EAC-5100-R64 : 2048-core NVIDIA Ampere™ architecture GPU with 64 Tensor Cores
DL Accelerator 2x NVDLA Engines
Memory
EAC-5100-R32 :  1 32GB LPDDR5 DRAM
EAC-5100-R64 : 1 64GB LPDDR5 DRAM 
Software Support
- Linux
- NVIDIA JetPack SDK
I/O Interface 
USB
- 1 USB 3.2 Gen 2
- 4 USB 3.1
Serial  2 COM RS-232/422/485
CAN Bus 2 Isolated CAN Bus support CAN FD
DIO 16 Isolated DIO (8 DI, 8 DO)
Micro USB
- 1 Micro USB console debug port
- 1 Micro USB OS flash port
Button
- 1 Power Button
- 1 Force Recovery Button
- 1 Reset Button
LED Power, SSD, 2 User Programmable
SIM 2 SIM Card Socket
Antenna 6 Antenna for WiFi/4G/5G/LTE/GPRS/UMTS 
Expansion
PCIe 1 PCIe x16 slot with PCIe 3.0 x8 signal
M.2
- 1 M.2 Key B Socket (3042/3052, USB3)
- 1 M.2 Key E Socket (2230, PCIe/USB)
Graphics
Interface 1 Digital Display, up to 8K60
Video Encode EAC-5100-R32 : 1x 4K @60, 3x 4K @30, 6x 1080p @60, 12x 1080p @30 (HEVC)
EAC-5100-R64 : 2x 4K @60, 4x 4K @30, 8x 1080p @60, 16x 1080p @30 (HEVC)
Video Decode EAC-5100-R32 : 1x 8K @30, 2x 4K @60, 4x 4K @30, 9x 1080p @60, 18x 1080p @30 (HEVC)
EAC-5100-R64 : 1x 8K @30, 3x 4K @60, 7x 4K @30, 11x 1080p @60, 22x 1080p @30 (HEVC)
Storage
M.2 2 M.2 Key M Socket (2280, PCIe Gen3 x4)
eMMC 1 eMMC 5.1, 64GB
SD 1 Micro SD (External)



Ethernet
LAN 1
10/100/1000 Base-T Ethernet GigE LAN, RJ45 Connector
(Optional X-coded M12 Connector)
LAN 2
10/100/1000 Base-T Ethernet GigE LAN, RJ45 Connector
(Optional X-coded M12 Connector)
Ethernet (PoE)
LAN 3 IEEE 802.3at (25.5W/48V) GigE PoE+ LAN, RJ45 Connector (Optional X-coded M12 Connector)
LAN 4 IEEE 802.3at (25.5W/48V) GigE PoE+ LAN, RJ45 Connector (Optional X-coded M12 Connector)
LAN 5 IEEE 802.3at (25.5W/48V) GigE PoE+ LAN, RJ45 Connector (Optional X-coded M12 Connector)
LAN 6 IEEE 802.3at (25.5W/48V) GigE PoE+ LAN, RJ45 Connector (Optional X-coded M12 Connector)
Power
Power Input DC 9V to 50V 
Power Interface 3-pin Terminal Block : V+, V-, Frame Ground
Ignition Control 16-mode Software Ignition Control
Remote Switch 3-pin Remote Switch Terminal Block
Mechanical
Dimensions 260 mm x 182 mm x 69 mm (10.24"x 7.17" x 2.72")
Weight 3.8 kg (8.39 lb)
Mounting
- Wallmount by mounting bracket
- DIN Rail Mount (Optional)
Environment
Operating Temperature
30W TDP Mode : -25°C to 70°C (-13°F to 158°F)
40/50W TDP Mode : -25°C to 55°C (-13°F to 131°F)
Storage Temperature -40°C to 85°C (-40°F to 185°F)
Humidity 5% to 95% Humidity, non-condensing
Relative Humidity 95% @ 70°C
Shock Operating, MIL-STD-810G, Method 516.7, Procedure I
Vibration  Operating, MIL-STD-810G, Method 514.6, Procedure I, Category 4
EMC CE, FCC, EN50155, EN50121-3-2